According to the new report, the upcoming Samsung flagship heats up much lesser than its predecessor while performing the same task. The device reportedly didn’t show any overheating warning while playing Genshin Impact. The warning appeared on the Galaxy S21 Ultra though. This result is from the Snapdragon 8 Gen 1 variant of the Galaxy S22 Ultra. Hopefully, the Exynos variant of the new phone will also bring similar thermal improvements to the table. The Exynos 2200, which will power the Galaxy S22 series in some markets, features an AMD GPU. Early reports have painted a promising picture of the new chipset, but it’s the real-world performance that matters.
Galaxy S22 Ultra could be the smartphone camera to beat in 2022
Samsung’s Galaxy S22 series is expected to set a new bar for Android smartphone OEMs in 2022. The Galaxy S22 Ultra, in particular, could be the smartphone camera to beat next year. While the phone will feature the same 108-megapixel sensor (ISOCELL HM3) found on the back of the Galaxy S21 Ultra for the main camera, rumors suggest the new phone will capture significantly better images. Ice Universe, who claims to have seen camera samples from the upcoming flagship, recently revealed that the Galaxy S22 Ultra captures more detail. Shots are also better in terms of color and brightness. Now, the same source has revealed some more information about camera performance improvements of the Galaxy S22 Ultra. The new Samsung flagship has reportedly made “great progress” in night photography. The company has improved its low-light focusing and shake adjustments. The device also now captures more light for brighter shots in dim environments. While Galaxy S22 leaks are coming thick and fast, the devices are still more than a month away. Samsung is said to unveil the new flagship trio in February next year. Ahead of that, the company will finally take wraps off the long-rumored Galaxy S21 FE. The new Fan Edition phone may launch on January 4, followed by a global release on January 11. We will keep you posted.
